SAMPLE GROWTH

• Joule evaporation deposition (Au, Au, AuGe, AuZn, Ni, etc)
• e-beam evaporation deposition (Au, Pt, Ti, Al, etc.)
• Chemical Vapour Deposition (CVD) 
• Sputtering for magnetic materials (Fe, Ni, Co, FeNi, etc)
• Molecular Beams Epitaxy (MBE) for semiconductors (AlGaInAs and AlGaInN families)
• Electrodeposition of Au, Ni, CoP, etc.
• Air-bridge contacts fabrication

PROCESSING TECHNIQUES

Lithography

• E-line nanolithography (line resolution > 10 nm)
• Photolithography
• Optical Mask design

Chemical, thermal and mechanical treatment

• Cleaning (Organic, acid chemicals…)
• Polishing
• Precission cutting
• Reactive Ion Etching (RIE)
• Wet Etching
• Standard Thermal Annealing
• Rapid Thermal Annealing (RTA)

Soldering and packaging

• Soldering
• TO-5 Packaging
• TO-8 Packaging
• Other Packaging

SAMPLE CHARACTERIZATION

Optical

• Sample preparation for measurements at both low and room temperature
• Photoluminescence (PL) measurement (IR-VIS-UV), at temperatures within the range 10-300K
• Electroluminescence (EL) measurement
• FTIRS measurement (400 nm-20 microns)

Optoelectronic

• Device Preparation
• Spectral responsivity for detectors measurement (from 12 micron to 200 nm)
• Spectral laser emission measurement (from 600 to 1700 nm)
• Spectral luminescence emission measurement (from 200 nm to 2.5 micron)

Electrical and Magnetical

• Resistivity measurements, room temperature
• Hall measurement, variable with temperature (15-300K)
• C-V and I-V measurement at room temperature, as well as temperature and frequency dependence

Microscopy and structural

• Measurements of thickness in thin films and surface measurements
• Contrast microscope photograph (electronic file) and polarization
• Characterization by SEM microscopy (image, catoluminescence and EDX)
• AFM and MFM Characterization
• X-Ray Diffraction Spectrum