Services

• SAMPLE GROWTH
  • Joule evaporation deposition (Au, AuGe, AuZn, Ni, etc)
  • e-beam evaporation deposition (Au, Pt, Ti, Al, etc.)
  • Chemical Vapour Deposition (CVD) for isolators (Si-O-N systems)
  • Sputtering for magnetic materials (Fe, Ni, Co, FeNi, etc..)
  • Molecular Beams Epitaxy (MBE) for semiconductors (AlGaInAs and AlGaInN families)
  • Electrodeposition of Au, Ni, CoP, etc.
  • Air-bridge contacts fabrication
• PROCESSING TECHNIQUES
  • Lithografy
    • E-line nanolithography (line resolution > 10 nm)
    • Electron beam lithography (EBL) (resolution > 300 nm)
    • Photolithography (resolution > 1 micron)
    • Optical Mask design
  • Chemical, Thermal and Mechanical Treatment
    • Cleaning (Organic, acid chemicals...)
    • Polishing (machine and hand)
    • Precission cutting
    • Reactive Ion Etching (RIE)
    • Wet Etching
    • Standard Thermal Annealing
    • Rapid Thermal Annealing (RTA)
  • Soldering and packaging
    • Soldering
    • TO-5 Packaging
    • TO-8 Packaging
    • Other Packaging
• SAMPLE CHARACTERIZATION
  • Optical Characterization
    • Sample preparation for measurements at both low and room temperature
    • Photoluminescence (PL) measurement (IR-VIS-UV), at temperatures within the range 10-300K
    • Electroluminescence (EL) measurement
    • FTIRS measurement (600 nm-20 microns)
  • Optoelectronic Characterization
    • Device Preparation
    • Spectral responsivity for detectors measurement (from 12 micron to 200 nm)
    • Spectral laser emission measurement (from 600 to 1700 nm)
    • Spectral luminescence emission measurement (from 200 nm to 2.5 micron)
    • L-I curves in UV-VIS-IR lasers
  • Electrical and Magnetical Characterization
    • Resistivity measurements, room temperature
    • Hall measurement, variable with temperature (100-300K)
    • C-V and I-V measurement at room temperature, as well as temperature and frequency dependence
    • Hysteresis Cycles for thin films
  • Microscopy and Structural Characterization
    • Thickness measurements in thin films and surface measurements
    • Contrast microscope photograph (electronic file) and polarization
    • Sample preparation for SEM measurements
    • EDX characterization with SEM, with reference
    • Surface characterization by SEM
    • AFM and MFM Characterization
    • X-Ray Diffraction Spectrum

Follow this link to obtain ISOM-UPM application form to access the CT-ISOM (MS-Word format): APPLICATION FORM

Access to: Services offer under Spanish Ministry of Education and Science funding