The goal of CT-ISOM is to offer its infrastructure
and research-technological experience to the European industrial and
academic community. The application fields of CT-ISOM are detection,
processing, transmission and recording of information by means of Opto-
and Micro-electronics. The training of innovating professionals will be
accomplished through their participation in such research and development
tasks. Three distinct features are characteristic of CT-ISOM:
- Availability of the required technology to be able to provide
pre-industrial control and reproducibility, as well as technology
transfer to industries
- Vocation to develop scientific and technological collaborations
between industry and academic institutions
- Wish to offer external services on characterization, quality control
and reliability, in the framework of Optoelectronics and Technology
for Communications and Information.
CT-ISOM also offers collaboration schemes to suit industries'
needs for usage of laboratory and cleanroom facilities during arranged periods
of time. For that purpose, CT-ISOM provides special rooms available to industries
for R&D activities, assuring industrial and intellectual property protection.
Moreover, CT-ISOM intends to participate in the generation of spin-off's by means
of temporary agreements on usage of space and technological equipment
as well as human resources.
CT-ISOM wants to highlight its desire to develop collaboration
schemes with universities and research centres. In this case, the collaboration
consists of training doctors, joint doctorate programmes, and the development
of technology and research.
Finally, CT-ISOM wants to offer its
services on technology
and characterization to the scientific and technical community. Thus, it hopes
to count on facilities promoted by UPM and other institutions, which could be
useful to this community in the field of electronics, optoelectronics and
communications (several high resolution microscopy techniques, materials
analysis, characterization of components, modules and systems, packaging,